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CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film

Product Details

Brand Name: Jingtan

Certification: CE

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: USD12,000-100,000/SET

Packaging Details: wooden case packing

Delivery Time: 60 days

Payment Terms: L/C/T/T

Supply Ability: 30 Piece/Pieces per Quarter

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Specifications
Highlight:

Deposition Equipment For Semiconductor Material

,

CVD Furnace For Semiconductor Material

Place Of Origin:
Hunan, China
Type:
Induction Furnace
Usage:
Deposition Furnace
Video Outgoing-inspection:
Provided
Machinery Test Report:
Provided
Core Components:
PLC
Brand Name:
Jingtan
Voltage:
380
Weight (t):
2 T
Power (kw):
220
Key Selling Points:
Competitive Price
Design Temperature (℃):
1250-2200
Woring Temperature:
900-1200℃
Pressure Rise Rate (Pa/h):
0.67Pa/h(150Pa/24h)
Heating Method:
Resistance/induction
Working Atmosphere:
Vacuum/CH4/C3H6/H2/N2/Ar
Furnace Type:
Square/roundVertical/Horizontal
Furnace Cooling Mode:
Furnace Shell Water Cooling
Infrared Instrument:
Single/double Colorimetric
Temperature Uniformity:
±5
Limit Vacuum Degree(Pa):
1-100
Marketing Type:
Ordinary Product
Warranty Of Core Components:
1 Year
Applicable Industries:
Other, Semiconductor
Place Of Origin:
Hunan, China
Type:
Induction Furnace
Usage:
Deposition Furnace
Video Outgoing-inspection:
Provided
Machinery Test Report:
Provided
Core Components:
PLC
Brand Name:
Jingtan
Voltage:
380
Weight (t):
2 T
Power (kw):
220
Key Selling Points:
Competitive Price
Design Temperature (℃):
1250-2200
Woring Temperature:
900-1200℃
Pressure Rise Rate (Pa/h):
0.67Pa/h(150Pa/24h)
Heating Method:
Resistance/induction
Working Atmosphere:
Vacuum/CH4/C3H6/H2/N2/Ar
Furnace Type:
Square/roundVertical/Horizontal
Furnace Cooling Mode:
Furnace Shell Water Cooling
Infrared Instrument:
Single/double Colorimetric
Temperature Uniformity:
±5
Limit Vacuum Degree(Pa):
1-100
Marketing Type:
Ordinary Product
Warranty Of Core Components:
1 Year
Applicable Industries:
Other, Semiconductor
Description
CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film
Specification: 
Vacuum deposition furnace:
Mainly used for the preparation of carbon-carbon composite materials, and the deposition furnace is mainly used for the preparation of pyrolytic carbon coating on the surface of graphite, semiconductor devices and heat-resistant scour materials.
Parameter /Model No.
JT-0305-C
JT-0505-C
JT-0608-C
JT-0608-C
JT-0812-C
JT-1120-C
JT-1218-C
JT-1520-C
Working Zone Size
φ×H(mm)
300×500
500×500
600×800
600×1200
800×1200
1100×2000
1200×1800
1500×2000
Highest Temperature
(℃)
2300
2300
2300
2300
2300
2300
2300
2300
Temperature uniformity(℃)
±5
±5
±5/±7.5
±7.5/±10
±7.5/±10
±10/±15
±10/±15
±15/±20
Limit Vacuum Degree(Pa)
1-100
1-100
1-100
1-100
1-100
1-100
1-100
1-100
Limit Vacuum Degree(Pa)
0.67
0.67
0.67
0.67
0.67
0.67
0.67
0.67
Heating method
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
Resistance/induction
CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film 0
Design temperature
1250℃/1650℃/1800℃/2200℃
Common temperature
 900~1200℃
Vacuum degree
< 50Pa
Pressure rise rate
 6.67pA /h(or 150Pa/24h) in cold state of empty furnace
Heating mode
graphite resistance heating or induction heating, independent temperature control, good temperature uniformity
Atmosphere medium
 vacuum /CH4/C3H6/H2/N2/Ar
CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film 1
Gas control mode
mass flow meter control, multi-channel gas path, uniform flow field, no deposition dead Angle, good deposition effect;Multi-stage and efficient exhaust treatment system, environmentally friendly, easy to clean up
 Furnace type
square, round, vertical or horizontal structure (non-standard design), fully enclosed deposition chamber, good sealing effect,
strong anti-pollution ability;
Furnace cooling mode
furnace shell water cooling, external circulation quick cooling system can be selected, short cooling time, high production
efficiency;
CVD Furnace Deposition Equipment for Semiconductor Material Preparation Thin Film 2
Structure form
 horizontal - side discharge, vertical - up/down discharge
Locking mode
manual/automatic
Shell material
inner stainless steel/all stainless steel
 Insulation material
carbon felt/graphite felt/carbon fiber cured felt
Infrared instrument
single colorimetric/double colorimetric
Power supply
KGPS/IGBT(only suitable for medium frequency heating)
Product parameter:
 
 
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