Door Locking Mode Vacuum Deposition Furnace For Graphite And Semiconductor Devices

The Vacuum deposition furnace is used for the preparation of carbon-carbon composite materials, and the deposition furnace is mainly used for the preparation of pyrolytic carbon coating on the surface of graphite, semiconductor devices and heat-resistant scour materials.

Scope of application:

Graphite, semiconductor devices, heat-resistant scour materials.

1. Basic Parameters:

1) Design temperature: 1250℃/1650℃/1800℃/2200℃

2) Common temperature: 900~1200℃

3) Vacuum degree: < 50Pa

4) Pressure rise rate: 6.67pA /h(or 150Pa/24h) in cold state of empty furnace

5) Heating mode: graphite resistance heating or induction heating, independent temperature control, good temperature uniformity

6) Atmosphere medium: vacuum /CH4/C3H6/H2/N2/Ar

7) Gas control mode: mass flow meter control, multi-channel gas path, uniform flow field, no deposition dead Angle, good deposition effect;

Multi-stage and efficient exhaust treatment system, environmentally friendly, easy to clean up;

8) Furnace type: square, round, vertical or horizontal structure (non-standard design), fully enclosed deposition chamber, good sealing effect, strong anti-pollution ability;

9) Furnace cooling mode: furnace shell water cooling, external circulation quick cooling system can be selected, short cooling time, high production efficiency;

2. Structure of vacuum deposition furnace:

Structure form: horizontal - side discharge, vertical - up/down discharge

Furnace door locking mode: manual/automatic

Furnace shell material: inner stainless steel/all stainless steel

Insulation material: carbon felt/graphite felt/carbon fiber cured felt

Heater, muffle material: graphite /CFC

Infrared instrument: single colorimetric/double colorimetric

Power supply: KGPS/IGBT(only suitable for medium frequency heating)

Produce Specification: